Heat has been the ceiling of AI
CORIS removes it
Removing the thermal blanket to enable 40% more performance
01The problem
AI chips are now limited by heat
Chips keep getting more powerful, but the heat they produce can no longer get out fast enough.
1 in 10
GPUs fail in their first year of operation
Performance capped
Heat throttles chips below their full potential.
Cooling costs
Cooling eats a growing share of every data center budget.
Die hot spots
On the chip itself, local heat limits every die.
02The solution
We integrate the cooling inside the package
By removing the thermal blanket between chip and coolant, heat leaves the silicon where it is formed
Today
−40%
Thermal resistance, die to coolant
CORIS
03The impact
+40%
More performance from the same silicon
And down the chain
€15B
Silicon saved every year
200 TWh
Electricity saved
04Why CORIS
The only complete answer to heat inside the package
Size, speed and die integrity, answered together. Built on complementary lines of academic research.
Any size
Cooling that scales for large packages.
100× faster
Faster to manufacture than the best alternative.
High reliability
Uncompromised integrity and long-term reliability.
CORIS: a new era for every chip
Learn more about CORIS
Help us build the next era of compute
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